It is suitable for the SMT process of electronic products, spot welding, spraying and heat sink welding.

From the fine production of solder paste, the refinement and classification of tin powder, to the production and sales of solder paste; from the technological innovation of leaded solder paste to environmentally friendly lead-free and halogen-free no-clean solder paste, Hongqiao's technology and wisdom are all condensed Crystallization. The product adopts a proprietary organic activation mixture formula, and some of the proprietary additives added to the product can reduce the surface tension between the solder mask and the solder, thereby significantly reducing the probability of solder ball formation. Plate designs that are sensitive to solder bridging or applications that require pin testability and extremely high requirements for low solder ball formation rates.

Environmental classification

Leaded Sn63Pb37

Representative model: NCP-838

Lead-free SnAg3.0Cu0.5; SnAg1.0Cu0.5; SnAg0.3Cu0.7; SnBi57.6Ag0.4; SnBi35.0Ag1.0; SnBi58

Representative model: SAC303; SAC310; SAC890; SAC8900; SAC8902; SAC8903; SAC8906; SAC8908; SAC8909; SAC8912; SAC8913; SAC8915; SAC8916; SAC8918; SAC8919; SAC8920; SAC8921; SAC8922; SAC8923; SAC8925; SAC8926; SAC8928; SAC8929; SAC8930; SAC8931; SAC8932; SAC8933; SAC8935; SAC8936; SAC8937; SAC8938; SAC8939; SAC8500; SAC8910; SAC258-8500; SB-500; SB-600; SB-700; SB800; SAC107-890GS; SB900

Packaging: 500g/bottle (bottled) or 125g/bottle (syringe) (special packaging can be based on customer needs)

Method of use: printing, spraying and tin soldering

It is suitable for the SMT process of electronic products, spot welding, spraying and heat sink welding.

From the fine production of solder paste, the refinement and classification of tin powder, to the production and sales of solder paste; from the technological innovation of leaded solder paste to environmentally friendly lead-free and halogen-free no-clean solder paste, Hongqiao's technology and wisdom are all condensed Crystallization. The product adopts a proprietary organic activation mixture formula, and some of the proprietary additives added to the product can reduce the surface tension between the solder mask and the solder, thereby significantly reducing the probability of solder ball formation. Plate designs that are sensitive to solder bridging or applications that require pin testability and extremely high requirements for low solder ball formation rates.

Environmental classification

Leaded Sn63Pb37

Representative model: NCP-838

Lead-free SnAg3.0Cu0.5; SnAg1.0Cu0.5; SnAg0.3Cu0.7; SnBi57.6Ag0.4; SnBi35.0Ag1.0; SnBi58

Representative model: SAC303; SAC310; SAC890; SAC8900; SAC8902; SAC8903; SAC8906; SAC8908; SAC8909; SAC8912; SAC8913; SAC8915; SAC8916; SAC8918; SAC8919; SAC8920; SAC8921; SAC8922; SAC8923; SAC8925; SAC8926; SAC8928; SAC8929; SAC8930; SAC8931; SAC8932; SAC8933; SAC8935; SAC8936; SAC8937; SAC8938; SAC8939; SAC8500; SAC8910; SAC258-8500; SB-500; SB-600; SB-700; SB800; SAC107-890GS; SB900

Packaging: 500g/bottle (bottled) or 125g/bottle (syringe) (special packaging can be based on customer needs)

Method of use: printing, spraying and tin soldering