Description
BGA solder balls-SAC105 (0.500-0.889), SAC305 (0.500-0.889), suitable for welding IC packages, BGA bumping or repair bumping.
Representative models: SAC105-500; SAC105-600; SAC305-500; SAC305-600
Packing: 150K, 200K, 250K, 500K, 1000K/bottle Electroplating tin balls: suitable for electroplating tin plating.
Packing: 20KG/carton (special packaging can be based on customer needs)
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BGA solder balls-SAC105 (0.500-0.889), SAC305 (0.500-0.889), suitable for welding IC packages, BGA bumping or repair bumping.
Representative models: SAC105-500; SAC105-600; SAC305-500; SAC305-600
Packing: 150K, 200K, 250K, 500K, 1000K/bottle Electroplating tin balls: suitable for electroplating tin plating.
Packing: 20KG/carton (special packaging can be based on customer needs)
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