What is the relationship between solder paste and solder powder?
Published:
2020-12-22 19:25
What is the relationship between solder paste and solder powder?
Solder powder, also known as solder paste, is mainly composed of tin lead alloy, with a general proportion of 63/37; When there are other special requirements, a certain amount of silver, bismuth and other metal tin powder is also added to the tin lead alloy. Benchmark the current performance of existing solder pastes. Test the main functional characteristics that can affect the first pass pass rate of vision and power. In order to achieve repeatability and product neutrality, this test is best done offline on the test model.

All repetitions in a set of benchmark tests should be recorded in detail so that we can find out what can be attributed to the solder paste performance. At this time, the consumption and waste can also be recorded. If possible, the factory conditions at the time of the benchmark test, such as temperature, humidity, operator, plate batch number, solder paste, and even components, should also be recorded. The important point is that the tin powder particle size distribution should be uniform. Here, we will talk about the proportion of tin powder particle size distribution; In domestic solder powder or solder paste manufacturers, we often use the distribution ratio to measure the uniformity of solder powder.
Hongqiao Technology Co., Ltd. is a high-tech enterprise specializing in the research, development and production of cutting fluid, electronic hardware cleaner, surface treatment agent, welding materials: solder paste, tin rod, tin wire, BGA solder ball, SMT tin, electronic flux and thinner, electronic welding equipment and accessories, electroplating anode plate (rod), semi tin ball and other products.
Hongqiao Technology Co., Ltd. is a high-tech enterprise specializing in the research, development and production of cutting fluid, electronic hardware cleaner, surface treatment agent, welding materials: solder paste, tin rod, tin wire, BGA solder ball, SMT tin, electronic flux and thinner, electronic welding equipment and accessories, electroplating anode plate (rod), semi tin ball and other products.
Recommended News