PCBA chooses the solder paste process for products without wave soldering on one or both sides of the patch. When the patch surface is on the same side as the welding surface of the solder piece, the patch chooses the red glue process.

The difference between the reflow red glue process and the solder paste process is as follows:
1. Red glue plays a fixed role and will not conduct electricity. Solder paste also plays a fixed role but will conduct electricity;
2. Red glue can be welded only after wave soldering
3. The temperature of red glue wave soldering is lower than that of solder paste wave soldering.
4. Red glue is generally used as auxiliary material and is generally used for fixing. Because solder paste can conduct electricity, it is often used during welding.
The functions of the double process of reflow soldering red glue+solder paste are as follows:
In the mixed process of reflow soldering red glue process and solder paste process, in order to avoid the secondary furnace pass of single side reflow once and wave peak once, red glue should be applied to the components on the wave peak soldering surface of PCB, and tin should be applied once during wave peak soldering to eliminate the solder paste printing process.
One is red glue, and the other is solder paste. The red glue plays an auxiliary role in fixing. The red glue is not conductive, and the solder paste is conductive. The solder paste is the real welding role. The red glue is used to weld solder paste during wave soldering.
Hongqiao Technology Co., Ltd. is a high-tech enterprise specializing in the research, development and production of cutting fluid, electronic hardware cleaner, surface treatment agent, welding materials: solder paste, tin rod, tin wire, BGA solder ball, SMT tin, electronic flux and thinner, electronic welding equipment and accessories, electroplating anode plate (rod), semi tin ball and other products.